Target Bonding 比分捷报即时
Target Bonding 比分捷报即时
In addition to sputtering target products, we offer provide OEM bonding services for sputtering targets of various sizes. The 比分捷报即时 content includes bonding process, backplane warpage flating and bonding layer ultrasonic inspection...etc.
During the sputtering process, backing plate serves is used to strengthen sputtering 比分捷报即时 and conduct heat. The bonding ratio of backing plate and sputtering target will directly affect the sputtering process and the quality of thin film, and may even affect the product lifetime of sputtering target.
For 比分捷报即时 made from different materials and in different shapes, SOLAR can provide the most suitable bonding process to fit clients’ sputtering process or sputter.
For 比分捷报即时 made from different materials and in different shapes, SOLAR can provide the most suitable bonding process to fit clients’ sputtering process or sputter.
- 比分捷报即时 come in planar, rotary or special-shaped.
- Backing plate materials include copper, titanium and molybdenum.
