Semiconductor Packaging and Testing
Bonding 足球比分
Metal Wires for Semiconductor IC and LED Packaging.
Bonding 足球比分 is a metal 足球比分 connecting electrodes in semiconductor IC or LED chips with terminals on lead frames. It is an indispensable material for transmitting signals in chips.
- Main products include silver alloy bonding 足球比分 series and coated silver bonding 足球比分 series.
- Characteristics of silver alloy 足球比分:
(1) May apply in N2or N2+H2 gas environment;
(2) 足球比分 with low hardness to avoid damage on aluminum pad;
(3) Workability and reliability are comparable to gold 足球比分.
- Characteristics of silvercoated 足球比分:
(1) Antioxidant activity;
(2) Resists sulfidation reaction;
(3) Improve the reliability and service life of materials.
| Silver Alloy Series | |||
|---|---|---|---|
| Product Type | AG0B | AG0E | AG0F |
| Major Composition(wt.%) | 88% Ag | 96% Ag | 98% Ag |
| Resistivity(µΩ.cm) | 4.7 | 3.2 | 2.5 |
| Coated 足球比分 Series | ||
|---|---|---|
| Product Type | ABG4 | AFG1 |
| Major Composition(wt.%) | 87% Ag | 97% Ag |
| Resistivity(µΩ.cm) | 4.7 | 2.5 |
